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Precautions for Handling of Laser diode

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If you are handling a semiconductor laser for the first time, please pay attention to the following points. In addition, please refer to the application note and product specifications. Also, please avoid handling the laser outside the range of absolute maximum ratings, as this may lead to breakdowns or performance degradation.

Electrostatic discharge and surge protection

  • Laser diode products are extremely sensitive to static electricity and surges, which may cause damage to the product or a significant decrease in its performance and lifespan.
    Implement counter measures to electrostatic discharge and surge at all processes, from receiving the products to mounting (assembly) on circuit boards, etc.
    In addition, please handle the product with care and implement surge protection measures for the drive circuit from the design stage.

  • Specific counter measures against static electricity include earthing equipment and workers, humidifying the environment (avoiding dry environments), and using static electricity removal blowers.
    Specific surge counter measures include not touching the probe to the product or circuit contacts while electricity is flowing, using a power supply with low ripple, using a slow starter circuit, etc.

Heat dissipation

  • When laser diode products are turned on, they generates both laser light and heat to the outside.
    If heat dissipation measures are not sufficient, the product temperature will rise, which may result in reduced performance and lifespan or even failure.

  • The radiated heat has various influences not only on the product itself but also on the surrounding equipments.
    In the worst case scenario, smoke or fire may occur, so please take appropriate measures.

  • It is important to keep the temperature of the laser chip, i.e. the junction temperature Tj, low.
    To achieve this, please control the ambient temperature Ta and case temperature Tc. Also, please perform sufficient simulations for both circuit design and structure design.

Handling of Laser Diodes before and after thier implementation

  • Do not clean the product as this may damage the chips and components.

  • When cutting or forming the leads, do not apply strong stress to the product.

  • Never touch the light-emitting surface of the product, as this may reduce its performance and lifespan.

  • If dust or dirt adheres to the light-emitting surface, the optical characteristics will be degraded. Keep the working environment clean.

  • Laser diode products have electrical polarity. Please be careful not to connect them in the wrong direction as they will be damaged.

  • When soldering, avoid heating the entire package. Instead, heat only the leads for a short period of time using hand soldering or similar.

  • When using adhesives, volatile components may affect the Laser Diode product. In particular, if siloxane adheres to the product, its performance may degrade.

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