We will attend the 27th China International Optoelectronic Exposition (Sep 9‑11, Shenzhen World). Come and discover our new optoelectronic products & solutions. Our team is ready for technical consultation and business talks at Booth 4D045 . Welcome to visit us.
UV curing is a high-efficiency, environmentally friendly photochemical manufacturing technology widely used in modern precision industrial production. Different from traditional thermal curing that relies on high-temperature baking, UV curing uses specific ultraviolet photon energy to excite photoinitiators inside UV glue, resin, ink and coating materials, triggering instantaneous cross-linking polymerization reactions. It converts liquid materials into solid high-molecular structures within seconds, achieving fast surface drying, bonding fixing and surface hardening without high-temperature heating.
LDI, the full name of Laser Direct Imaging, is a digital maskless lithography technology that has completely replaced traditional film exposure processes in high-end printed circuit board manufacturing, covering rigid PCB, flexible FPC, HDI boards and IC packaging carrier boards. The traditional PCB exposure process relies on physical photomask films; circuit patterns are transferred to the photoresist coated on substrates through film light shielding. This process inevitably brings multiple defects such as film thermal expansion and contraction deviation, surface dust pollution, film scratches and high film production costs.
LDI, the full name of Laser Direct Imaging, is a digital maskless lithography technology that has completely replaced traditional film exposure processes in high-end printed circuit board manufacturing, covering rigid PCB, flexible FPC, HDI boards and IC packaging carrier boards. The traditional PCB exposure process relies on physical photomask films; circuit patterns are transferred to the photoresist coated on substrates through film light shielding. This process inevitably brings multiple defects such as film thermal expansion and contraction deviation, surface dust pollution, film scratches and high film production costs.
