LDI, the full name of Laser Direct Imaging, is a digital maskless lithography technology that has completely replaced traditional film exposure processes in high-end printed circuit board manufacturing, covering rigid PCB, flexible FPC, HDI boards and IC packaging carrier boards. The traditional PCB exposure process relies on physical photomask films; circuit patterns are transferred to the photoresist coated on substrates through film light shielding. This process inevitably brings multiple defects such as film thermal expansion and contraction deviation, surface dust pollution, film scratches and high film production costs.
The 650nm red laser module is one of the most mature, cost-effective and widely used visible semiconductor laser solutions in the industrial optics industry. With a moderate wavelength, excellent beam collimation and stable luminous performance, the 650nm red laser achieves balanced visibility and system compatibility, making it the standard light source for industrial positioning, auxiliary marking and low-light machine vision inspection.
The 405nm violet laser module is a core near-ultraviolet semiconductor laser widely used in industrial high-precision processing and optical inspection fields. Benefiting from its short wavelength and high photon energy, the 405nm laser delivers stronger material excitation capability compared with common red and green visible lasers, making it uniquely suitable for resin activation, fluorescent reaction triggering and micro-defect identification.
The 520nm green laser module is a high-performance visible semiconductor laser specially designed for industrial positioning, auxiliary marking and visual calibration. Compared with traditional 650nm red laser modules, the 520nm green laser possesses extremely high human-eye visibility, delivering brighter, finer and more concentrated beam performance even under strong ambient light, outdoor sunlight and complex factory lighting conditions.
