300mW 405nm Fiber Coupled Laser Diode Module

The 300mW 405nm Fiber Coupled Laser Diode Module—a precision-engineered light source optimized for Laser Direct Imaging (LDI) systems in PCB manufacturing. Leveraging 405nm violet wavelength’s superior photoresist absorption, 300mW stable output, and low-loss fiber coupling, this module delivers ultra-high resolution patterning for HDI boards, IC substrates, and flexible FPCs, ensuring consistent, high-quality imaging in high-volume electronics production.

Core Advantages for LDI Machine Integration

405nm Wavelength: Optimized for LDI Photoresist Patterning

• 405nm (±5nm tolerance) violet light aligns with the absorption peak of acrylate-based photoresists— the standard material for LDI PCB imaging—enabling sub-20μm linewidth resolution with sharp edge definition and minimal sidewall roughness.

• Outperforms 375nm UV wavelengths in penetration depth (up to 30μm) for thick photoresist layers, while avoiding over-exposure issues common with higher-power 450nm blue lasers, perfectly matching LDI’s high-precision imaging requirements.

300mW Stable Output: Balanced Precision & Efficiency

• CW mode output with lower power fluctuation over 24 hours (25°C), eliminating pattern distortion caused by energy drift during long production runs.

• 300mW power density achieves fast exposure speeds without compromising patterning accuracy, supporting LDI machine throughput of up to 120 panels per hour.

Low-Loss Fiber Coupling: Flexible LDI Optics Integration

• Equipped with UV-grade multimode silica fiber (core diameter 105μm, NA=0.22, coupling efficiency ≥85%), enabling precise energy delivery to LDI machine’s galvanometer scanning system.

• Fiber length customizable (1m–3m) with SMA-905/ FC industrial connectors, compatible with mainstream LDI equipment brands (e.g., Orbotech, Camtek), and supporting compact machine layout designs.

• Collimated fiber output ensures a uniform beam profile across the imaging field, eliminating hotspots that cause photoresist over-exposure.