High Power Water Cooling 10W 405nm Fiber Coupled Laser Module for Direct Imaging Machine

High Power 10W 405nm Fiber Coupled Laser Module

The Water Cooling High Power 10W 405nm Fiber-Coupled Laser Module—a cutting-edge industrial solution engineered for ultra-stable, high-throughput precision processing. Combining 405nm violet wavelength’s superior material absorption, 10W continuous output, and efficient water cooling system, this module delivers reliable, targeted energy for demanding industrial applications requiring 24/7 continuous operation.

Core Advantages (Water Cooling-Centric)

1. Efficient Water Cooling: Ultra-Stable High-Power Operation

Dedicated water cooling system and precise temperature control (20°C~28°C), ensuring laser diode junction temperature ≤65°C during continuous 10W output.

Eliminates thermal drift and power decay common in air-cooled modules, supporting uninterrupted industrial production (24/7 runtime) without performance degradation.

2. 405nm Violet Wavelength: Precision & Absorption Optimization

405nm wavelength (±5nm tolerance) achieves 3–8x higher absorption on photoresists, non-ferrous metals (copper, aluminum), and UV-curable resins vs. 1064nm IR lasers.

Enables sub-10μm fine-patterning for HDI PCBs and micro-components, while offering 50μm~80μm material penetration—balancing precision and processing efficiency.

3. 10W High Power

Stable CW output with lower power fluctuation over 24 hours, delivering energy density ≥12,000mW/cm² at the fiber tip.

Reduces processing time compared to 3W modules (e.g., 1mm thick UV resin cured in ≤0.8 seconds vs. 4 seconds); supports high-speed production lines.

Key Applications

Industrial Processing

• PCB Laser Direct Imaging (LDI): Fine-patterning for HDI boards, IC substrates, and flexible FPCs with sub-10μm linewidths.

• UV Curing: High-speed curing of UV inks, adhesives, and conformal coatings in electronics/automotive assembly.

• Microfabrication: Precision structuring of polymers, glass, and thin films for MEMS, microfluidics, and semiconductor components.

Advanced Manufacturing

• 3D Printing: High-power light source for large-format SLA/DLP 3D printers, enabling fast curing of thick resin layers (≥5mm) with intricate details.

• Material Processing: Laser ablation, surface modification (hydrophilic/hydrophobic treatment), and metal thin-film deposition.

Scientific Research

• Biomedical Research: Fluorescence excitation, photodynamic therapy (PDT) studies, and cell imaging.

• Material Science: Polymer aging testing, nanomaterial synthesis, and laser-induced breakdown spectroscopy (LIBS).