4IN1 405nm 415nm 435nm 375nm Laser Total 40W Four Wavelength Fiber Coupled Laser Module for PCB Mask Curing

4IN1 40W Multi-Wavelength Fiber-Coupled Laser Module

The 4IN1 40W Multi-Wavelength Fiber-Coupled Laser Module—a cutting-edge integrated solution engineered exclusively for PCB mask curing (solder mask, photoresist curing) in high-volume electronics manufacturing. Combining four UV-violet wavelengths (375nm/405nm/415nm/435nm) with 40W total output power and precision fiber coupling, this module delivers tailored energy absorption for diverse PCB mask resins, ensuring ultra-fast curing, uniform film quality, and compatibility with rigid PCBs, FPCs, and HDI boards.

Core Advantages for PCB Mask Curing

1. 4-In-1 Multi-Wavelength Optimization: Universal Resin Compatibility

• 375nm UV-A: Aligns with absorption peaks of epoxy-based solder masks, enabling deep curing of thick masks (≥50μm) without thermal deformation.

• 405nm Violet: Optimized for acrylate-based photoresists and HDI board fine-patterning (sub-10μm linewidths), ensuring sharp edge definition.

• 415nm Violet-Blue: Enhances curing efficiency of hybrid resins (epoxy-acrylate blends), reducing oxygen inhibition for smoother mask surfaces.

• 435nm Blue-Violet: Improves adhesion of low-viscosity solder masks on copper traces, minimizing pinholes and micro-cracks.

• Independent Power Control: Each wavelength supports 5W–15W adjustable output (total 40W), allowing customization for specific resin formulations and PCB thicknesses.

2. 40W High Total Power: Boost Production Throughput

• With water cooling systems built in, Stable CW output with ≤±2% power fluctuation per wavelength.

• Reduces curing time by 70% compared to single-wavelength 10W modules (e.g., 1.2mm thick PCB mask cured in ≤2 seconds vs. 6+ seconds).

• Supports high-speed inline production (up to 3m/min conveyor speed) for mass PCB manufacturing, without compromising curing uniformity.

3. Precision Fiber-Coupled Delivery: Uniform Curing Across PCB Surfaces

• Equipped with UV-grade multimode silica fiber (core diameter 105, NA=0.22, total coupling efficiency ≥95%).

• Single-fiber coaxial output of all four wavelengths ensures uniform energy distribution across large PCB areas (up to 600mm×600mm) and complex geometries (e.g., blind vias, microvias).

• Fiber length customizable (1.5m–5m) with SMA-905/ FC industrial connector, adapting to inline curing stations, robotic arms, or automated PCB lines.

Key Applications

• Primary Application: Solder mask curing for rigid PCBs, flexible FPCs, HDI boards, IC substrates, and automotive electronics PCBs.

• Resin Compatibility: Epoxy-based, acrylate-based, and hybrid (epoxy-acrylate) solder masks; liquid photoresists (LFR) and dry film photoresists (DFR).

• Extended Applications: Conformal coating curing for PCB assemblies, microfluidic chip photoresist curing, and high-precision electronic component patterning.