Powerful UV Laser Water Cooling 375nm 10W Fiber Coupled Laser Module for LDI Exposure Machine

Water Cooling 375nm 10W Fiber Coupled Laser Module

The Powerful UV Laser Water Cooling 375nm 10W Fiber-Coupled Laser Module—an industrial-grade high-power solution engineered for high-throughput UV processing. Combining 375nm UV-A wavelength’s optimal material absorption, 10W ultra-stable output, and efficient water cooling system, this module delivers precise, continuous energy for demanding industrial applications requiring long-duration, high-intensity UV exposure.

Core Advantages for Industrial UV Processing

1. 375nm UV-A Wavelength: Universal Material Compatibility

• 375nm wavelength (±5nm tolerance) aligns with absorption peaks of epoxy/acrylic-based photoresists, solder masks, UV inks, and polymers—ensuring rapid photopolymerization without material degradation.

• Outperforms longer UV wavelengths (385nm/395nm) in curing efficiencyand shorter UV-C (≤280nm) in penetration depth (up to 100μm), ideal for thick-film curing and deep-layer material processing.

• Superior absorption on non-ferrous metals (copper, aluminum) and semiconductors for UV-induced surface modification and micro-structuring.

2. 10W High Power + Water Cooling: 24/7 Stable Operation

• 10W CW output with lower power fluctuation over 24 hours, delivering energy density ≥10,000mW/cm² at the fiber tip—reducing processing time by 80% compared to 2W modules.

• Efficient water cooling system with adjustable flow rateand temperature control (20°C~30°C), ensuring junction temperature ≤75°C during continuous operation.

• Eliminates thermal drift and power decay common with air-cooled high-power modules, supporting uninterrupted industrial production lines.

Key Industrial Applications

• PCB Manufacturing: High-speed solder mask curing (rigid PCBs, FPCs, HDI boards), photoresist exposure for fine-patterning.

• UV Curing: Conformal coating curing, UV inkjet printing, adhesive bonding in electronics/automotive assembly.

• Microfabrication: Precision structuring of polymers, glass, and thin films for MEMS, microfluidics, and semiconductor components.

• Material Processing: UV-induced surface modification (hydrophilic/hydrophobic treatment), polymer aging testing, and nanomaterial synthesis.

• 3D Printing: High-power light source for large-format SLA/DLP 3D printers, enabling fast curing of thick resin layers.