High Power 150um 375nm 20W UV Fiber Coupled Laser Diode Module

BU-LASER introduces the industrial-grade 375nm 20W deep UV fiber-coupled laser diode module, a high-energy short-wavelength UV light source engineered for high-precision Laser Direct Imaging (LDI), micro photolithography, semiconductor wafer exposure, high-sensitivity photoresist curing, and micro-pattern direct writing systems. Equipped with genuine multi-emitter 375nm-380nm UV laser chips, precision space optical coupling structure, 150μm low-OH UV-resistant fiber, and high-efficiency water cooling system, this module delivers stable 20W continuous-wave fiber output, ultra-pure narrow-spectrum deep UV light and outstanding long-term stability, perfectly meeting the ultra-fine exposure demands of advanced precision manufacturing.

Core Competitive Advantages

1. 375nm Deep UV Wavelength: Optimized for High-Sensitivity Photoresist

375nm ±5nm short deep ultraviolet wavelength carries higher photon energy compared with mainstream 405nm UV lasers, featuring stronger absorption efficiency for positive/negative photoresists, dry film and special imaging resins.

Generates sharper pattern edges with ultra-low Line Edge Roughness (LER ≤5μm), eliminating blurry outlines and pattern distortion;

Supports faster exposure speed and thinner line width manufacturing, ideal for HDI circuit boards, flexible FPC and micro-semiconductor components;

Narrow spectral linewidth ≤3nm FWHM restrains stray visible light interference, ensuring high-fidelity pattern transfer without substrate yellowing after exposure.

2. 20W High Fiber-Coupled Optical Power to Boost Production Throughput

Delivers stable 20W real CW optical power at fiber end with 0–20W stepless power adjustment, greatly lifting exposure efficiency compared with low-power 5–12W 375nm modules, compatible with large-format substrates up to 550×550mm and thick photoresist layer processing.

3. 150μm UV Low-OH Fiber

Standard matching fiber core: 150μm UV-resistant low-OH multimode silica fiber (NA=0.22), anti-UV aging cladding with minimal deep UV transmission attenuation, resistant to long-term high-power laser irradiation damage;

High-precision SMA-905 optical interface (FC/PC optional), coupling efficiency ≥85%.

Standard fiber length 2m, customizable range from 1–10m with UV anti-kink protective sleeve, supporting separated layout of laser host and exposure chamber to avoid heat interference on sensitive substrates.

4. High-Efficiency Dual-Loop Water Cooling

Exclusive dual-loop precise temperature control matched with a high-flow active water cooling system, thermal resistance ≤0.3°C/W. It stably maintains laser diode junction temperature at 46±2°C under full 20W power operation, thoroughly solving thermal drift, wavelength shift, and power decay caused by heat accumulation.

Fanless zero-noise design without dust accumulation, fully adaptable to ISO Class 6 clean room environment required for semiconductor and PCB precision exposure equipment, MTBF ≥10,000 hours supporting 24/7 non-stop mass production.

5. Industrial PWM Modulation & Full-Range Safety Protection

Wide voltage DC 24V input (22–26V tolerance), compatible with mainstream LDI lithography equipment power systems. Supports high-frequency PWM modulation 0–100% duty cycle (customizable 1–100kHz) with ≤30ns ultra-fast response, fully synchronized with DMD digital micromirror and high-speed galvanometer scanning systems for dynamic accurate exposure control.

Integrated all-in-one constant current drive with multi-layer protection circuits: over-temperature, over-current, over-power, reverse polarity connection, fiber breakage interlock protection. Automatically shuts down laser output within 10ms under abnormal status to avoid equipment and operator injury.

Core Specification :

Note: As it is a fiber-bundled laser, we can increase or decrease the quantity of the laser diode inside to change the power so that the power can be from 1W to 100W. And the fiber also can be selected by you!