Powerful 375nm 40W UV Fiber Coupled Laser Diode Module for Photolithography Equipment

BU-LASER presents this industrial-grade 375nm 40W bundled fiber-coupled UV laser diode module, engineered for high-precision photolithography and PCB LDI laser direct imaging systems. It uses multi-emitter UV laser diodes and high-efficiency space optical coupling, paired with a non-detachable integrated bundled UV fiber and built-in constant-current driver with comprehensive safety protection. It delivers stable 40W fiber output power, superior spectral purity and consistent beam uniformity, well suited for HDI, FPC, IC carrier board dry film & liquid photoresist exposure and other high-resolution lithography manufacturing.

Core Advantages for Photolithography

1. 375-380nm Short-Wave UV for High-Resolution Lithography

378nm ±5nm UV wavelength matches the absorption spectrum of mainstream PCB photoresists, dry films and liquid resists.

- Higher photon energy enables finer line-width patterning and low line-edge roughness, ideal for ultra-fine circuit fabrication of HDI & FPC;

- Narrow spectral linewidth ≤4nm FWHM, minimal stray light, reduces substrate thermal deformation during long scanning exposure;

- Low thermal load protects thin flexible substrates against warpage, fits mass production of flexible circuit boards.

2. 40W CW Fiber Output Power, Boost Throughput for LDI Exposure

Genuine 40W CW optical power at the fiber end, 0–100% stepless power adjustment. Higher power shortens single-point exposure time and improves scanning speed for large-format lithography equipment.

Adopts a constant-current driving design. Stable long-run continuous operation, consistent UV energy output to guarantee uniform imaging quality batch by batch.

3. Non-Detachable Integrated Bundled UV Fiber

- Integrated bundled UV low-OH multimode silica fiber, single fiber core 150μm, NA=0.22, anti-UV aging cladding, low transmission loss under long-duration high-power UV irradiation;

- Non-detachable bundled fiber structure. Optimized bundle arrangement provides excellent near-field beam uniformity; no power loss risk from repeated plugging;

- Standard fiber length 2m, customizable 1–12m with UV-resistant anti-kink metal sleeve. Separates laser host and scanning exposure head to isolate heat source from optical path.

After matched homogenizing optics, it generates flat-top uniform illumination for high-precision scanning lithography.

4. Built-In Active Water Cooling  for 24/7 Continuous Production

Integrated compact circulating water cooling system, designed for high heat load under 40W full-power continuous operation.

- Efficient internal flow channel quickly dissipates diode heat and suppresses power attenuation caused by thermal accumulation;

- Fanless structure prevents dust contamination, fits cleanroom environment. MTBF ≥10,000 hours for non-stop lithography production lines.

5. Multiple Control Modes & Full Set of Protection Circuits

DC 24V wide input voltage (22–26V tolerance), compatible with industrial lithography machine control systems.

Supports three independent control modes:

1. High-frequency PWM modulation: 1–1kHz, 0–100% duty cycle;

2. Built-in analog modulation: 0–5V analog voltage for linear power adjustment;

3. RS485 Modbus RTU communication: remote power configuration, real-time operating status reading and laser on/off control.

Integrated multi-protection circuits: over-temperature, over-current, over-voltage and reverse polarity protection.